Circuit board having a stamped substrate

Details Circuit board having a stamped substrate Circuit board having a stamped substrate

1991-07-18

1993-07-20

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361401, 29832, H05K 100

Patent

active

052295486

ABSTRACT:
A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

REFERENCES:
patent: 3541223 (1970-11-01), Helms
patent: 3660726 (1972-05-01), Ammon et al.
patent: 3670409 (1972-06-01), Reimer
patent: 3685002 (1972-08-01), Kennedy
patent: 3945808 (1976-03-01), Sheesley et al.
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 3977074 (1976-08-01), Furnival
patent: 4028798 (1977-06-01), Bechard et al.
patent: 4371744 (1983-02-01), Badet et al.
patent: 4394710 (1983-07-01), Brower et al.
patent: 4435741 (1984-03-01), Shimizu et al.

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