Removable encapsulant for protection of electronic equipment

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29627, 174 52PE, 264112, 264272, H01B 1900

Patent

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041188616

ABSTRACT:
A method of providing an easily removable encapsulant for electronic circuit assemblies is disclosed. According to the method, a body of a suitable inexpensive, low density, foamed silicone rubber which is environmentally and electrically stable is divided into pellets or fine particles. The pellets or particles are poured into a circuit assembly housing to fill voids between the housing and the circuit assembly itself. Since the encapsulating material does not adhere to the circuit assembly or the housing and retains its particulate character in use, it may be removed by simply pouring it out of the circuit assembly housing when desired.

REFERENCES:
patent: 2897252 (1959-07-01), Martin
patent: 3001105 (1961-09-01), Fox
patent: 3677981 (1972-07-01), Wada et al.
Modern Plastics Encyclopedia for 1961, 9-1963, vol. 41, No. IA., pp. 360-, "Foamed Plastics (foamed silicones)".
Kirkwood & Key, Electronics, "Aluminia Powder for Potting: It Pours", 12-1959, pp. 92 & 94.

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