Surface-mounted multilayer capacitor and printed circuit board h

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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H01G 113

Patent

active

050539167

ABSTRACT:
A surface-mounted multilayer capacitor and a printed circuit board having such a capacitor. The capacitor comprises a multilayer of electrodes and dielectric layers which are alternately stacked. End contacts of the electrodes consist of a thin sprayed-metal layer and a U-shaped cap which engages the capacitor in a clamping manner. The sprayed-metal layer and the cap can contact each other electrically via a solder layer. Preferably, the sprayed-metal layer is impregnated with a thermocuring synthetic resin and the synthetic resin is removed from a part of the sprayed-metal layer. The capacitor preferably comprises coating layers which are cemented to the multilayer by means of an adhesive layer.

REFERENCES:
patent: 2442810 (1948-06-01), Haas
patent: 2820934 (1958-01-01), Mullikin
patent: 3244953 (1966-04-01), Walsh et al.
patent: 3513369 (1970-05-01), England et al.
patent: 4613518 (1986-09-01), Ham et al.
patent: 4672506 (1987-06-01), Deguchi et al.

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