Method for manufacturing a semiconductor device using a circuit

Fishing – trapping – and vermin destroying

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437205, 437208, 437966, 437974, 156DIG88, 29 2501, H01L 2120, H01L 2122, H01L 21304, H01L 2152

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052583252

ABSTRACT:
The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.

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