Method for bonding semiconductor elements to a tab tape

Details Method for bonding semiconductor elements to a tab tape Method for bonding semiconductor elements to a tab tape

1992-06-17

1993-06-29

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 731, 264 23, 29827, 29840, 228110, 228179, B32B 3116, H05K 334

Patent

active

052230635

ABSTRACT:
Method for bonding inner leads installed on a tab tape, which is fed in one direction in a bonding line, to electrodes of semiconductor elements via ultrasonic vibrations applied to a bonding tool mounted at one end of horn is performed in such a manner that the direction in which the ultrasonic vibrations are applied to the bonding tool is in the range of 30 to 60 degrees, preferably 45 degrees, with respect to the direction in which the tab tape is fed so that the bonding tool oscillates in such angles.

REFERENCES:
patent: 3698985 (1972-10-01), Robinson
patent: 4759073 (1988-07-01), Shah et al.
patent: 4958762 (1990-09-01), Shimizu et al.

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