Variable pitch IC bond pad arrangement

Details Variable pitch IC bond pad arrangement Variable pitch IC bond pad arrangement

1988-06-24

1989-10-17

Kucia, R. R.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 70, 361392, 361400, 361405, H05K 0118

Patent

active

048751383

ABSTRACT:
The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic at variable pitch with the bond pad widths (47) increasing as a function of the distance (49) of each pad from an alignment point (40), whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the alignment point (40) of the package have the narrowest width.

REFERENCES:
patent: 4003073 (1977-01-01), Helda et al.
patent: 4366342 (1982-12-01), Breedlove
patent: 4513355 (1985-04-01), Schroeder
patent: 4725692 (1988-02-01), Ishii et al.
patent: 4733462 (1988-03-01), Kawatani
patent: 4753820 (1988-06-01), Cusak

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