Method of bonding utilizing a heat activated polyamide adhesive

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

260 78S, 428458, 428474, C09J 506, C08G 7310, B32B 2734, B32B 1508

Patent

active

039390292

ABSTRACT:
High strength structural metal-to-metal bonds can be achieved in 10 to 15 seconds by placing a resinous polyamide capable of imidizing between the metal surfaces to be bonded and heating the composite to a temperature sufficiently high (.gtoreq. 400.degree.F) to induce imidization.

REFERENCES:
patent: 3576691 (1971-04-01), Meyers
patent: 3654227 (1972-04-01), Dine-Hart
patent: 3745149 (1973-07-01), Serafini et al.
patent: 3821072 (1974-06-01), Campbell et al.

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