Method of making a metal-gate MOS VLSI device

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437913, 437984, 437947, 437 40, 148DIG20, H01L 21265, H01L 300

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048747203

ABSTRACT:
A simplified process for metal gate and contact/interconnect systems for MOS VLSI devices employs a refractory metal structure for the gate, including a thick layer of tungsten alone, with stress and adhesion controlled by the deposition conditions. The metal gate receives sidewall oxide spacers during a metal-cladding operation for the source/drain areas. Contacts to the source/drain region include a molybdenum/tungsten stack and a top layer of gold.

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Miller, Nicholas and Israel Beinglass, "Hot-Wall CVD Tungsten for VLSI", Solid State Technology, Dec. 1980, pp. 79-82.
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