Semiconductor device having supporting electrode composite struc

Details Semiconductor device having supporting electrode composite struc Semiconductor device having supporting electrode composite struc

1974-10-21

1976-07-13

James, Andrew J.

357 66, 357 67, 357 81, H01L 2348, H01L 2940, H01L 2946, H01L 2962

Patent

active

039697541

ABSTRACT:
A semiconductor device comprising a semiconductor substrate and a supporting electrode disposed at least on one surface of the semiconductor substrate, in which the supporting electrode has such a composite structure that fibers having a coefficient of thermal expansion substantially equal to or lower than that of the semiconductor substrate are embedded in a matrix of a metal having electric and heat conductivities higher than those of the fibers. This supporting electrode has a satisfactorily high heat conductivity and the coefficient of thermal expansion thereof is freely adjustable.

REFERENCES:
patent: 3097329 (1963-07-01), Siemens
patent: 3128419 (1964-04-01), Waidkotter
patent: 3273029 (1966-09-01), Ross
patent: 3295089 (1966-12-01), Moore
patent: 3399331 (1968-08-01), Mutter et al.

Affiliated with

Also associated with

Rating

Semiconductor device having supporting electrode composite struc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having supporting electrode composite struc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having supporting electrode composite struc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1743293