Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-11-02
1989-10-17
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, 439364, H01R 2372
Patent
active
048743186
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
This invention relates to an arrangement for mounting an integrated circuit chip carrier to a printed circuit board (pcb) and also to a pcb/chip carrier combination incorporating said mounting arrangement.
BACKGROUND TO THE INVENTION
In a mounting arrangement known from U.S Pat. No. 4,506,938, a socket is cemented to the pcb and receives both a contact interface member equipped with conductive interconnecting elements and the chip carrier, together with a compression spring which acts on the chip carrier to clamp the interface member between said pcb and said chip carrier with the interconnecting elements in electrical contact both with interface contacts on the chip carrier and contact pads on the pcb. In practical form the known arrangement is relatively complicated and there is risk of non-uniformly distributed clamping forces acting at the electrical interfaces.
A similar mounting arrangement is disclosed in European Patent Specification EP-B-0105628, in which an interface member is secured at each corner by a bolt to a pcb. An intergrated circuit chip carrier is then clamped against the interface member by a resilient lid which is sprung under each bolt head. Such a mounting is, in practice, similarly complicated to the above-mentioned known arrangement.
In U.S. Pat. No. 4,376,560 there is disclosed a further arrangement in which a chip carrier is clamped via an interface member to a pcb. However, in this arrangement the interconnecting elements of the interface member are permenently connected to the pcb by soldering.
It is an object of this invention to provide an improved arrangement for mounting a chip carrier to a pcb.
THE INVENTION
According to one aspect of the invention, there is provided a mounting arrangement for mounting an integrated circuit chip carrier to a printed circuit board (pcb), comprising a first fastener for fixedly attaching to the chip carrier, a socket moulding carrying interconnection elements for establishing electrical connection between interface contacts on the chip carrier and interface contact pads on the pcb, said socket moulding being apertured to receive said first fastener of the chip carrier, and a second and complementary fastener for extending through an aperture in the pcb for engagement with said first fastener to clamp the socket moulding between the chip carrier and the pcb with said interface contacts and said contact pads interconnected by said interconnection elements.
Desirably, the first fastener and the socket moulding are provided with means for orientating said insert and said moulding so that the interconnecting elements engage the chip carrier interface contacts. Preferably, moreover, the socket moulding and the pcb are provided with means for orientating said moulding and said pcb so that the interconnecting elements engage the pcb contact pads.
In one embodiment, the first fastener comprises an internally screwthreaded boss externally shaped to be received in a correspondingly shaped aperture of the socket moulding in only one angular orientation of said insert and said moulding, the second fastener comprising a mounting screw. In this embodiment, the socket moulding preferably carried one or more projecting pins to be received in one or more corresponding apertures in the pcb in only one angular orientation of said moulding and said pcb.
The invention also extends to a pcb/chip carrier combination incorporating the above-described mounting arrangement. Thus, according to another aspect of the invention, there is provided a printed circuit board/integrated circuit chip carrier combination, including a socket moulding having slots accommodating interconnecting elements which establish electrical conductive contact both with interface contacts on the chip carrier and with contact pads on the pcb, wherein the chip carrier is mounted to the pcb by means of an internally screwthreaded fastener bonded to the chip carrier and received in an aperture in said socket moulding, the latter being clamped between the pcb and the c
REFERENCES:
patent: 4278311 (1981-07-01), Scheingold et al.
patent: 4293175 (1981-10-01), Cutchaw
patent: 4376560 (1983-03-01), Olsson et al.
patent: 4420767 (1983-12-01), Hodge et al.
patent: 4506938 (1985-03-01), Madden
Abrams Neil
Flexicon Systems Limited
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