Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-02-22
1998-06-16
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
29593, 257714, 361719, H05K 720
Patent
active
057681040
ABSTRACT:
A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.
REFERENCES:
patent: 4324104 (1982-04-01), Horn
patent: 4381032 (1983-04-01), Cutchaw
patent: 5014904 (1991-05-01), Morton
patent: 5119759 (1992-06-01), Hicks
patent: 5311060 (1994-05-01), Rostoker
patent: 5325265 (1994-06-01), Turlik
Dravis Daniel John
Salmonson Richard B.
Cray Research Inc.
Tolin Gerald P.
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