High molecular weight polystyrene and method

Details High molecular weight polystyrene and method High molecular weight polystyrene and method

1987-12-14

1989-05-23

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

526323, 5263232, 526327, C08F 2602, C08F 2226

Patent

active

048332232

ABSTRACT:
A method for producing a high molecular weight polystyrene comprises polymerizing styrene monomer and from about 0.01 to about 2.0 parts by weight per 100 parts by weight total monomer of a polyfunctional monomer in an emulsion polymerization medium. Preferred polyfunctional monomers include allyl groups, vinyl groups or mixtures thereof, and the resultant high molecular polystyrene preferably has a weight average molecular weight, Mw, greater than about 400,000.

REFERENCES:
patent: 2808386 (1957-10-01), D'Alelio
patent: 3098839 (1963-07-01), Conard et al.
patent: 3259595 (1966-07-01), Wright
patent: 3435018 (1969-03-01), Natta et al.
patent: 3645959 (1972-02-01), Pilato et al.
patent: 3700639 (1972-10-01), Hulse
patent: 3817965 (1974-06-01), Mace et al.
patent: 3819761 (1974-06-01), Lee, Jr.
patent: 3976725 (1976-08-01), Lee, Jr.
patent: 4029869 (1977-06-01), Ingram et al.
patent: 4031166 (1977-06-01), Bronstert et al.
patent: 4112209 (1978-09-01), Gunsher et al.
patent: 4335037 (1982-06-01), Lordi et al.
Odian, George, Principles of Polymerization, Second Edition, John Wiley & Sons, New York, 1981, pp. 286-288 and 319-339.

Affiliated with

Also associated with

Rating

High molecular weight polystyrene and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High molecular weight polystyrene and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High molecular weight polystyrene and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1731456