Structure of copper conductor and method of forming same

Details Structure of copper conductor and method of forming same Structure of copper conductor and method of forming same

1982-01-08

1989-05-23

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174 685, 428209, 428432, 428433, 428544, 428615, 428620, 428900, B32B 327

Patent

active

048330043

ABSTRACT:
A structure of a copper conductor is obtained by oxidizing copper film formed on the surface of a substrate, and by heat treating the same in a reducing atmosphere, whereby only the surface layer portion of the oxidized copper film is reduced to become copper. The copper film of a conductor is formed on the surface of the substrate with the oxidized copper film interposed therebetween. As a result, an adhesion of the copper film to the surface of the substrate is enhanced.

REFERENCES:
patent: 3846152 (1974-11-01), Franz
patent: 4072771 (1978-02-01), Grier, Sr.
patent: 4189331 (1980-02-01), Roy
patent: 4311729 (1982-01-01), Itakura et al.

Affiliated with

Also associated with

Rating

Structure of copper conductor and method of forming same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure of copper conductor and method of forming same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure of copper conductor and method of forming same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1730147