Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1995-12-18
1998-06-16
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257786, 257780, H01L 2348, H01L 2352, H01L 2940
Patent
active
057675805
ABSTRACT:
A digital system utilizing at least one semiconductor integrated circuit die having positive mechanical alignment is provided between substrates using micro-bump contacts by forming "detented" conductive bump contacts on one substrate having a concave end which receive and align the generally convex contour of bump contacts on the other substrate. Various configurations of concavities and convexities are described. Flux may be disposed in the concave end of the detented bump contact to promote formation of joints between the concave and convex bump contacts. Both bump contacts may be formed of reflowable material, such as solder, or one or the other of the contacts may be formed of a non-reflowable material which may also function as a standoff between the two substrates. Each substrate is provided with a plurality of bump contacts, and one substrate may be provided with a combination of convex and concave bump contacts corresponding to concave and convex bump contacts on the other substrate. The inventive technique is useful for joining die-to-die, die-to-substrate, or package-to-substrate in a digital system.
REFERENCES:
patent: 3339274 (1967-09-01), Saia et al.
patent: 3461357 (1969-08-01), Mutter et al.
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4700276 (1987-10-01), Freyman et al.
patent: 4717066 (1988-01-01), Goldenberg et al.
patent: 4801992 (1989-01-01), Golubic
patent: 4825284 (1989-04-01), Soga et al.
patent: 4857482 (1989-08-01), Saito
patent: 4912545 (1990-03-01), Go
patent: 4926241 (1990-05-01), Carey
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5077633 (1991-12-01), Freyman et al.
patent: 5108950 (1992-04-01), Wakabayashi et al.
patent: 5111279 (1992-05-01), Pasch et al.
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5404047 (1995-04-01), Rostoker et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 5525838 (1996-06-01), Kaneko
Honda, Susumu--Mounting Technology for MCM and Bare Chips--New Technology Development Makes Bare Chip Mounting Easy--May 1994, pp. 37-42.
Packaging Ideas by Howard Markstein Electronic Packaging & Production, May 1992, pp. 25-26.
LED Array Modules by New Technology Microbump Bonding Method by Kenzo Hatada, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 3, Sep. 1990.
Overmolded Plastic Pad Array Carriers by Bruce Freyman, et al. 0569-5503/91/0000-0176, 1991 IEEE.
Lead-Indium for Joining a Semiconductor Chip to a Substrate L.S. Goldmann, et al. IBM Technical Disclosure Bulletin, vol. 16, No. 11, Apr. 1974.
Cao Phat X.
Crane Sara W.
LSI Logic Corporation
LandOfFree
Systems having shaped, self-aligning micro-bump structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems having shaped, self-aligning micro-bump structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems having shaped, self-aligning micro-bump structures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1729338