Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1999-08-12
2000-11-28
Potter, Roy
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, H01L 2334
Patent
active
061539325
ABSTRACT:
An improved fix base of a heat sink used to dissipate the heat produced by an integrated circuit chipset in a personal computer is disclosed. The fix base includes a rectangular frame, which has two side plates downwards below the bottom of the two opposite sides. Each bottom part of the two opposite inner sides of the two side plates has a fastening hook, respectively. Each of the other two sides of the two side plates has a protruding rod downwards. A plurality of elastic rods are included in the inner side walls, and each elastic rod includes a protruding part at the bottom. The heat sink is inserted into the rectangular frame and then the chipset is hooked at the two respective sides by the fastening hooks. The protruding parts, further, press onto the top of the heat sink to tightly and closely attach the heat sink and the chipset. The heat sink may include a hole which is drilled for the protruding rod to penetrate in order to position the fix base and the heat sink.
REFERENCES:
patent: 5276585 (1994-01-01), Smithers
patent: 5831829 (1998-11-01), Lin
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