Semiconductor device for ultrahigh frequency band and semiconduc

Details Semiconductor device for ultrahigh frequency band and semiconduc Semiconductor device for ultrahigh frequency band and semiconduc

1994-09-13

1997-05-20

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35R, 174 51, 174 524, 257728, 257659, 257692, 257693, 257696, 333247, 361772, 361783, 361816, 361818, H05K 900, H05K 702, H01L 23043, H01L 23552

Patent

active

056318090

ABSTRACT:
A semiconductor device comprising a semiconductor chip, a sheet-like metal member electrically connected to a major surface of the semiconductor chip and serving as a ground electrode for the chip, and input/output electrodes electrically connected to the semiconductor chip and situated in the same plane as that of the sheet-like metal member, the chip, the metal member, and the input/output electrodes being encapsulated in an electrically insulating member having a bottom surface and adapted to be mounted on a surface of a circuit board. The sheet-like metal member is brought out from inside the electrically insulating member without being bent and has its one end face situated in substantially the same plane as the bottom surface of the electrically insulating member which faces to the surface of the circuit board when the metal member is mounted on the circuit board and the major surface of the chip is approximately prependicular to the end face of the sheet-like metal member.

REFERENCES:
patent: 5057805 (1991-10-01), Kadowaki
patent: 5075759 (1991-12-01), Moline
patent: 5294897 (1994-03-01), Notani et al.
"Maxim Integrated Circuits Data Handbook", 1989, p. A-12.
Claude L. Bertin, et al., "Evaluation of a Three-Dimensional Memory Cube System", IEEE Trans. on CHMT, vol. 16, No. 8, pp. 1006-1011, 1993.

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