Polyimide resin composition and semiconductor device encapsulate

Details Polyimide resin composition and semiconductor device encapsulate Polyimide resin composition and semiconductor device encapsulate

1991-10-21

1993-08-10

Dean, Jr., Ralph H.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525472, 525476, 525487, 525502, 525504, C08L 8310

Patent

active

052350053

ABSTRACT:
A curable polyimide resin is blended with (a) an organic silicon compound having a functional group selected from an epoxy group and an amino group or (b) a copolymer of an aromatic polymer and an organic silicon compound. The resulting polyimide resin composition can be cured without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

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