Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1999-07-27
2000-11-28
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
H01L 21302, H01L 21461
Patent
active
061535346
ABSTRACT:
A dual material gate is effectively fabricated for a field effect transistor having a short channel length of submicron and nanometer dimensions such that disadvantageous short channel effects are minimized. Generally, the method of the present invention includes a step of forming a first material gate portion on a gate dielectric. The first material gate portion has a source side and a drain side, and an aspect of the present invention further includes the step of depositing a spacer dielectric layer on the source side and the drain side of the first material gate portion. An aspect of the present invention also includes the step of implanting heavy ions into the spacer dielectric layer at an angle such that the spacer dielectric layer at the drain side of the first material gate portion is substantially not implanted with the heavy ions. The spacer dielectric layer is then selectively etched such that any portion of the spacer dielectric layer that is implanted with the heavy ions is etched. Thus, the spacer dielectric layer on the drain side of the first material gate portion is not etched, but the spacer dielectric layer on the source side of the first material gate portion is etched. In addition, an aspect of the present invention includes a step of selectively growing a second material gate portion from the first material gate portion that is exposed on the source side of the first material gate portion. In this manner, the dual material gate of the field effect transistor is comprised of the first material gate portion toward the drain of the field effect transistor and the second material gate portion toward the source of the field effect transistor.
REFERENCES:
patent: 5296398 (1994-03-01), Noda
patent: 5432106 (1995-07-01), Hong
patent: 5733792 (1998-03-01), Masuoka
Michael Shur, Split-Gate Field-Effect Transistor, Appl. Phys. Lett., vol. 54, No. 2, Jan. 9, 1989, pp. 162-164.
Wei Long and Ken K. Chin, Dual Material Gate Field Effect Transistor (DMGFET), IEDM, 1997, pp. 549-552.
Xing Zhou and Wei Long, A Novel Hetero-Material Gate (HMG) MOSFET for Deep-Submicron ULSI Technology, IEEE Transactions on Electron Devices, vol. 45, No. 12. Dec. 1998, pp. 1-3.
S. C. Song, H. F. Luan, Y. Y. Chen, M. Gardner, J. Fulford, M. Allen, And D. L. Kwong, Ultra Thin (< 20 .ANG.) CVD Si3N4 Gate Dielectric for Deep-Sub-Micron CMOS Devices.
P. Dollfus and P. Hesto, Monte Carlo Study of a 50 nm-Dual-Gate HEMT Providing Against Short-Channel Effects, Solid-State Electronics, vol. 36, No. 5, 1993, pp. 711-715.
Liu Yowjuang W.
Long Wei
Xiang Qi
Advanced Micro Devices , Inc.
Choi Monica H.
Umez-Eronini Lynette T.
Utech Benjamin
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