Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1981-09-28
1983-09-13
Saba, W. G.
Metal working
Method of mechanical manufacture
Assembling or joining
29575, 29576E, 29577C, 29584, 148174, 148175, 357 13, 357 15, 357 45, 357 59, 427 84, H01L 2120, H01L 21283, H01L 2710
Patent
active
044033990
ABSTRACT:
In a memory array wherein each cell includes an emitter follower, a diode is formed on the emitter by a thin layer which is capable of being shorted by vertical migration of bit line atoms through the layer and into the emitter region. The thin layer is fabricated by epitaxially growing the thin layer over the wafer with the emitter diffusion aperture open, oxidizing the epitaxial layer, selectively removing portions of the polycrystalline epitaxial layer and removing the oxide from the remaining epitaxial layer in the emitter diffusion aperture.
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Harris Corporation
Saba W. G.
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