Silver-based conductive paste and multilayer ceramic circuit sub

Details Silver-based conductive paste and multilayer ceramic circuit sub Silver-based conductive paste and multilayer ceramic circuit sub

1996-03-06

1998-06-16

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

106 119, H01B 122

Patent

active

057665168

ABSTRACT:
A silver-based electrically conductive paste used for printing on green sheets of a low-temperature firable ceramic comprising a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 --system glass and Al.sub.2 O.sub.3, wherein a silver-based powder in the conductive paste has a specific surface area in the range of 0.1 to 0.5 m.sup.2 /g and the formation of a scratch begins when the value measured with a grind gage for the paste containing an organic resin and an organic solvent is in the range of 30 to 10 .mu.m. The silver-based conductive paste makes it possible to co-fire with a low-temperature firable ceramic substrate without causing the warping of the substrate and, therefore, is very useful for the formation of wiring conductors of internal layers of a multilayer circuit substrate of the low-temperature firable ceramic.

REFERENCES:
patent: 4051074 (1977-09-01), Asada
patent: 4459166 (1984-07-01), Dietz et al.
patent: 5045141 (1991-09-01), Salensky
patent: 5417745 (1995-05-01), Oprosky et al.

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