Lead frame with each lead having a peel generation preventing me

Details Lead frame with each lead having a peel generation preventing me Lead frame with each lead having a peel generation preventing me

1997-05-29

2000-03-14

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257782, 257787, 257671, 361813, 174 522, 252672, 252692, H01L 2328, H01L 2350, H01L 23495

Patent

active

06037652&

ABSTRACT:
A lead frame is provided that prevents breaks in bonding wires caused by thermal stress which is applied when mounting a resin semiconductor. A plating layer is applied to the surfaces of internal leads to which bonding wires are to be connected and an insulating tape is adhered the internal lead 1 tips and bonding balls, so as to prevent peeling between the internal leads 1 and the resin, thereby preventing breaking of a bonding wire cause by stress applied during mounting. Additionally, a semiconductor device which makes use of this lead frame structure is provided.

REFERENCES:
patent: 5276351 (1994-01-01), Yamuzuki et al.
patent: 5424578 (1995-06-01), Fujita et al.
patent: 5540318 (1996-07-01), Mahulikor et al.
patent: 5554886 (1996-09-01), Song
patent: 5710457 (1998-01-01), Uno

Affiliated with

Also associated with

Rating

Lead frame with each lead having a peel generation preventing me does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame with each lead having a peel generation preventing me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame with each lead having a peel generation preventing me will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-172005