Optical device package including an aligned lens

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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Details

257433, 257434, H01L 310232, H01L 310203

Patent

active

060376414

ABSTRACT:
An optical device package. The optical device package includes a first substrate. The first substrate includes a light sensitive electronic device and several solder bumps. The electronic devices and the solder bumps are oriented on the first substrate according to a predetermined pattern. The optical device package further includes a second substrate. The second substrate includes a lens which is physically attached to the second substrate. The second substrate further includes several conductive pads which receive the plurality of solder bumps and align the light sensitive electronic device with the lens.

REFERENCES:
patent: 5394490 (1995-02-01), Kato et al.

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