Electrical make/break interconnect having high trace density

Details Electrical make/break interconnect having high trace density Electrical make/break interconnect having high trace density

1989-07-26

1990-07-10

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439329, 29846, 346140R, H01R 909

Patent

active

049404130

ABSTRACT:
A pressure make/break interconnect for two sets of coplanar, parallel traces (30 and 46) includes contact pads (50 and 52) on the ends of the one or both sets of traces (30 and 46), the pads (50 and 52) being wider than the spaces between the traces (30 and 46) but staggered so that there is room for the pads (50 and 52) to fit between the traces (30 and 46). One of each facing pair of the traces (30 and 46) or pads (50 and 52) has on its facing surface a bump (66), which serves as the actual contact point and aids in increasing the contacting pressure. An interconnect support (70) behind one of the pads (50 or 52) is configured to aid in intensifying the pressure applied through the bump (66), ensuring good contact. The interconnect support (70) is preferably made of an elastomer and has ridges ( 74 and 76) on both sides underlying the contact pads (50 and 52), with protrusions (80) on the ridges (74) facing the pads (50 and 52), that extend upwardly to support the contact pads (50 and 52) while the connection is made.

REFERENCES:
patent: 3716907 (1973-02-01), Anderson
patent: 4125310 (1978-11-01), Reardon, II et al.
patent: 4179802 (1979-12-01), Joshi et al.
patent: 4602317 (1986-07-01), Rovnyak et al.
patent: 4631555 (1986-12-01), Ikeda et al.
patent: 4635073 (1987-01-01), Hanson
patent: 4791440 (1988-12-01), Eldridge et al.
IBM Bulletin, vol. 28, No. 3, Elastomeric Module-to-Board Connector System.

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