Method of making injection-moulded printed circuit boards

Details Method of making injection-moulded printed circuit boards Method of making injection-moulded printed circuit boards

1991-11-07

1993-08-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 29847, 428901, H05K 320

Patent

active

052337537

ABSTRACT:
Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.

REFERENCES:
patent: 4584039 (1986-04-01), Shea
patent: 4584767 (1986-04-01), Gregory
patent: 4710419 (1987-12-01), Gregory
patent: 4810321 (1989-03-01), Wank et al.
patent: 4832989 (1989-05-01), Giesecke et al.
patent: 4868047 (1989-09-01), Hasegawa et al.
patent: 4906515 (1990-03-01), Inoguchi
patent: 4910045 (1990-03-01), Giesecke et al.
patent: 4944087 (1990-07-01), Landi
patent: 5108530 (1992-04-01), Niebling, Jr. et al.
IBM Technical Disclosure Bulletin vol. 2 No. 1 Jun. 1959, p. 9 by Haddad et al.
IBM Technical Disclosure Bulletin vol. 8 No. 8, Jan. 1966, pp. 1025-1025 by Webb et al.
IBM Technical Disclosure Bulletin vol. 9 No. 11 Apr. 1967, pp. 1520-1521 by Kollmeier et al.
IBM Technical Disclosure Bulletin vol. 14 No. 1 Jun. 1971 p. 101 by David et al.

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