Circuit board, method of making the circuit board and improved d

Details Circuit board, method of making the circuit board and improved d Circuit board, method of making the circuit board and improved d

1975-07-17

1976-11-09

Duzan, James R.

Metal working

Method of mechanical manufacture

Electrical device making

156261, 174 685, H05K 302

Patent

active

039901424

ABSTRACT:
Stamping a sheet of conductive foil by means of a die of a predetermined pattern against a dielectric substrate to shear out foil sections and pressing them against the substrate while applying heat through said die to the sheared sections so as to bond the sections by means of a thermal curing adhesive to the substrate. The die has a plurality of individual die elements which shear out individual foil sections. Each die element has two lateral high pressure surfaces, a recessed middle portion and two transitional surface portions between the high pressure surfaces and the middle portion. The outer edges of each die element are shearing corners or edges, with the high pressure surfaces applying the shearing forces to the foil and substrate. In one embodiment the high pressure surfaces which produce the shearing forces against the foil sheet are substantially parallel to the foil sheet being engaged, and in another embodiment the high pressure surfaces are sloped at about 45.degree. to the surface of the foil sheet it is engaging. The transitional surfaces of each die element are convexly curved toward the recessed middle to provide a proper force distribution which declines in magnitude toward the middle die portion, and join to the middle portion with a concave curvature.

REFERENCES:
patent: 3678577 (1972-07-01), Weglin et al.
patent: 3713944 (1973-01-01), Dennis et al.

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