Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-12
1998-11-24
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361689, 361704, 361698, 257706, 257714, 174 151, 174 163, 165 804, 165 805, 16510433, 165185, H05K 720
Patent
active
058416340
ABSTRACT:
A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port removes the liquid coolant from the chamber. A single unit plastic baffle is positioned within the chamber. The baffle includes strategically configured plenums, jet ports and transfer ports that direct the liquid coolant in both a series and parallel manner for increased cooling efficiency. The jet ports direct the liquid coolant onto the semiconductor devices in a parallel manner, and liquid coolant is transferred from one set of jets to another set of jets in a series manner.
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patent: 5563447 (1996-10-01), Lake et al.
patent: 5666269 (1997-09-01), Romero et al.
patent: 5675473 (1997-10-01), McDunn et al.
Chervinsky Boris L.
Delco Electronics Corporation
Funke Jimmy L.
Picard Leo P.
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