Electroless nickel plating solution

Details Electroless nickel plating solution Electroless nickel plating solution

1992-07-20

1994-04-26

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C23C 1836

Patent

active

053063341

ABSTRACT:
Phosphorus-containing, crystalline, nickel-coated fabric, wherein said nickel contains 1 to 6 weight percent phosphorus, has crystallites greater than 3 nanometers and has a surface resistivity of less than 1 ohm/square is deposited onto a substrate a surface which is catalytic to electroless deposition of nickel by immersing the substrate into an electroless nickel plating solution consisting essentially of nickel salt, one or more organic acids, hypophosphite reducing agent, thiourea and ammonia and essentially no heavy metal, wherein the concentration of said thiourea is less than 1 ppm, maintained at a pH of 6.5 to 8.5 and a temperature less than 60.degree. C. Preferred plating solutions comprise essentially no lead or cadmium and have a molar ratio of nickel to hypophosphite in said solution is 0.4 to 0.55. Preferred organic acids are selected from the group consisting of lactic acid, acetic acid, propionic acid, pyruvic acid, aspartic acid and glycolic acid.

REFERENCES:
patent: 3686020 (1972-08-01), Coll-Palagos
patent: 3971861 (1976-07-01), de Waltoff
patent: 3977884 (1976-08-01), Gulla et al.
Electroless Nickel Plating, Wolfgang Riedel; ASM International, Metals Park, Ohio, USA; Finishing Pub., Ltd., Stevenage Hertfordshire, England, pp. title pp. 13, 17-25, 41-44, 50-51, 64-70, 101-104, 245-251, 1991.

Affiliated with

Also associated with

Rating

Electroless nickel plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless nickel plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless nickel plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1709537