Method of manufacturing a molded semiconductor package having a

Details Method of manufacturing a molded semiconductor package having a Method of manufacturing a molded semiconductor package having a

1991-08-20

1994-02-22

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, H01L 2156, H01L 2158, H01L 2160

Patent

active

052886670

ABSTRACT:
In a method of manufacturing a semiconductor package with an externally connecting coupler, a semiconductor package has a die pad portion on which a semiconductor device is mounted and a plurality of leads including at least one lead extending from the die pad portion and coupled to each other by a tie bar. The method includes the steps of mounting the device on the die pad of the leadframe, wire bonding between the device and inner leads, premolding the inner leads so as to ensure mutual mechanical connection of the leads and support of the leads during manufacture, cutting off unnecessary portions of the leadframe and portions of the leadframe located between the leads to electrically separate the leads from each other, and forming a mold package and the external connecting coupler as one unit using an electrically insulating resin. The mold package seals the die pad portion of the leadframe on which the device is mounted, the inner leads and the premolding. The externally connecting coupler covers the outer leads so as to achieve mechanical coupling to an external device and hence electrical connection of the outer leads. A method in which an externally connecting coupler is coupled to the leadframe before cutting off the tie bar so as to ensure mutual mechanical connection of the leads of the leadframe and support of the leads during the manufacture is also included.

REFERENCES:
patent: 3418089 (1968-12-01), Berg
patent: 3439238 (1969-04-01), Birchler et al.
patent: 4320412 (1982-03-01), Hynes et al.
patent: 4794446 (1988-12-01), Hamano
patent: 4859632 (1989-08-01), Lumbard
patent: 5104827 (1992-04-01), Schneider et al.

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