High frequency electronic component having base substrate formed

Details High frequency electronic component having base substrate formed High frequency electronic component having base substrate formed

1993-11-10

1997-03-18

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174258, 361767, 361771, H05K 102

Patent

active

056125127

ABSTRACT:
A high-frequency electronic component includes: a base substrate and a high-frequency electronic component element which is mounted on one face of the base substrate by soldering. The base substrate is made of bismaleimide-triazine resin.

REFERENCES:
patent: 4081601 (1978-03-01), Dinella et al.
patent: 5237130 (1993-08-01), Kulesza et al.
patent: 5266748 (1993-11-01), Kawakami et al.
patent: 5346857 (1994-09-01), Scharr et al.
patent: 5402314 (1995-03-01), Amago et al.
patent: 5406459 (1995-04-01), Tsukamoto et al.

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