Peeling type developing apparatus

Details Peeling type developing apparatus Peeling type developing apparatus

1985-07-25

1986-12-23

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156344, 430256, B32B 3116

Patent

active

046311106

ABSTRACT:
A peeling type developing method and apparatus for removing exposed photoresist from printed circuit boards. The printed circuit board is covered with a photopolymerization compound layer and then a transparent support layer. After exposure, a thin adhesive tape is stuck to the support layer extending obliquely across the board and crossing opposite corners thereof. The adhesive tape, together with the support layer and the unexposed portions of the photoresist material, are peeled off the printed circuit board by a pair of pinch rolls with the aid of a peeling bar in line contact with the substrate through the adhesive tape and the support layer.

REFERENCES:
patent: 4165251 (1979-08-01), Matsumoto et al.
patent: 4183751 (1980-01-01), Matsumoto et al.
patent: 4285759 (1981-08-01), Allen et al.
patent: 4504571 (1985-03-01), Yamamura et al.
patent: 4508589 (1985-04-01), Tarui et al.

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