Positive resist composition comprising a quinone diazide sulfoni

Details Positive resist composition comprising a quinone diazide sulfoni Positive resist composition comprising a quinone diazide sulfoni

1992-08-18

1995-05-09

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430165, 430192, 430193, G03F 7023, G03F 730

Patent

active

054138957

ABSTRACT:
A positive resist composition comprising an alkali-soluble resin containing a novolak resin which is obtained by a condensation reaction of a phenol compound and a carbonyl compound and has an area in a GPC pattern of a range in that a molecular weight as converted to polystyrene is not larger than 900 not exceeding 20% of a whole pattern area excluding the unreacted phenol compound, a quinonediazide compound and a polyphenol compound of the formula: ##STR1## in which R.sub.1 and R.sub.2 are independently a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group or a group: --OCOR.sub.3 in which R.sub.3 is an alkyl group or a phenyl group, x and y are independently an integer of 1 to 3, and m is an integer of 0 to 4, wherein a weight ratio of said polyphenol compound (I) to said alkali-soluble resin is from 3:10 to 5:10, which is excellent in heat resistance, sensitivity, resolution and a depth of focus and leaves no scum after development.

REFERENCES:
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patent: 4812551 (1989-03-01), Oi et al.
patent: 5019479 (1991-05-01), Oka et al.
patent: 5128230 (1992-07-01), Templeton et al.
patent: 5178986 (1993-01-01), Zampini et al.
patent: 5340686 (1994-08-01), Sakaguchi et al.
Patent Abstract Of Japan, vol. 11, No. 181 (P-585) (2628) 11 Jun. 1987 & JP-A-62 010 646 (Kanto Kagaku K.K.).

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