Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-09-06
1997-03-18
Vu, Hien D.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 71, 439331, H01R 909
Patent
active
056116985
ABSTRACT:
A surface mounting IC socket includes an IC receiving section defined in a frame, and a plurality of contacts spaced apart in side-by-side relation along the frame. Leads of an IC received in the IC receiving section are brought into electrical connection with the contacts within the IC receiving section. Each contact includes a press-in plate portion which is to be pressed into the frame from a lower surface of the frame adapted to confront a wiring board, a contacting arm to be contacted with one of the IC leads extending toward the IC receiving section from a lower end of the press-in plate portion, and a surface mounting arm extending from a lower end of the press-in plate portion toward the IC receiving portion so as to be soldered to a pattern formed on the wiring board.
REFERENCES:
patent: 4934944 (1990-06-01), Kozel et al.
patent: 4936784 (1990-06-01), Saito
patent: 4941832 (1990-07-01), Korsunsky et al.
patent: 4984991 (1991-01-01), Nishimoto
Vu Hien D.
Yamaichi Electronics Co. Ltd.
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