Integrated socket and IC package assembly

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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Details

174 524, H01R 2372

Patent

active

054134897

ABSTRACT:
An integrated circuit package for demountable attachment to a printed circuit board or like device is formed from an integrated assembly of an IC chip and socket, The IC chip is permanently mounted to a chip carrier which spreads the contact area from a first area to a larger second area. The chip carrier or spreader is contained in a plastic socket formed of a cover and a base. The base has an array of apertures therethrough each of which is equipped with wadded wire/plunger contacts for conformal contact with both pads on the bottom of the chip carrier and pads on a circuit board.

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