Copper etching solution

Details Copper etching solution Copper etching solution

1987-07-01

1989-07-18

Powell, William A.

Compositions

Etching or brightening compositions

Inorganic acid containing

156666, 252 792, 252 793, C09K 1306, C09K 1304, B44C 122, C23F 100

Patent

active

048491241

ABSTRACT:
An aqueous copper etching solution is disclosed, containing customary acid etching means based upon iron chloride, copper chloride or peroxide compounds, characterized by an additional content of halogen compounds, preferably of the formula AX, in which A is hydrogen, ammonium or a univalent metal equivalent, and X is a halogen atom, and also a process for the adhesive application of contacts onto conductor plates having one or more metal cores, in particular iron-nickel or iron-cobalt cores, including the steps of etching the conductor plates with the mentioned copper etching solution, with or without an addition of organic compounds based upon aliphatic amines or alcohols, thioureas, aromatic thio-compounds, pyridinium compounds, pyrimidinium compounds, alkoxylated alcohols or phenols, at room temperature, then rinsing, activating and chemically metallizing the conductor plates. The contacted conductor plates prepared in this manner are employed in electronics and electrical engineering.

REFERENCES:
patent: 2908557 (1959-10-01), Black et al.
patent: 3650957 (1972-03-01), Shipley et al.
patent: 3770530 (1973-11-01), Fujimoto
patent: 3926699 (1975-12-01), Dixon
patent: 4110237 (1978-08-01), Matsumoto et al.
patent: 4410396 (1983-10-01), Somers et al.
patent: 4430152 (1984-02-01), Okano
patent: 4443295 (1984-04-01), Radigan et al.
patent: 4459216 (1984-07-01), Nakazato et al.

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