Low impedance bus bar

Details Low impedance bus bar Low impedance bus bar

1988-12-29

1991-09-24

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

361398, 361407, H01B 700

Patent

active

050515420

ABSTRACT:
A bus bar is presented which sandwiches a high capacitance flexible dielectric sheet material between the conductive layers. The high capacitance dielectric sheet is comprised of a monolayer of multilayer or single layer high dielectric (e.g. ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric (e.g. ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces. The whole structure is then sandwiched between two conductive layers. The result is a bus bar with a very low characteristic impedance.

REFERENCES:
patent: 3778735 (1973-12-01), Steenmetser
patent: 4401843 (1983-08-01), Harper et al.
patent: 4440972 (1984-04-01), Taylor
patent: 4908258 (1990-03-01), Hernandez

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