Organopolysiloxane compositions which vulcanise at ambient tempe

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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260825, C08L 8300

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active

039337294

ABSTRACT:
The properties of organosilicon compositions based on .alpha.-.omega.-dihydroxy diorganopolysiloxanes, methyl polysiloxanes, fillers, amino organosilicon corss linking agents and optionally alkyl silicates or polysilicates, which are vulcanisable at ambient temperature or above, are improved by using a methylpolysiloxane in which the ratio of the R(CH.sub.3).sub.2 SiO.sub.0.5 units (R=C.sub.1 --C.sub.3 alkyl or vinyl) to SiO.sub.2 units is 0.4:1 to 1.2:1 and which contains 0.5 - 3.5% by weight OH groups bonded to Si and by using an amino organosilicon compound which is an aminoorganosilane of the general formula (i) (R"O).sub.3.sub.- p R'.sub.p Si[(CH.sub.2).sub.n O].sub.m (CH.sub.2).sub.t NHQ in which R' represents an alkyl group with 1 to 4 carbon atoms, a vinyl group or a phenyl group, R" represents a methyl, ethyl or methoxyethyl radical, Q represents a hydrogen atom or the radical --(CH.sub.2).sub.2 NH.sub.2, p and m represent 0 or 1, n represents 1, 2, 3 or 4, and t represents 2 or 3, or an aminoorganopolysiloxane produced by reacting the aminoorganosilane (i) above, in which p is 0, with a hydroxylic methylpolysiloxane polymer (ii) containing at least 2% by weight of hydroxyl groups bonded to the silicon atoms, of viscosity 1 cPo at 25.degree.C to 1,000 cPo at 25.degree.C, of the average general formula (CH.sub.3).sub.a (HO).sub.b SiO.sub.(4.sup.-a.sup.-b)/2 in which a represents any number from 1.6 to 2.3 and b represents any number ranging from 0.1 to 1; the amounts of aminoorganosilane (i) and hydroxylic methylpolysiloxane polymer (ii) being such that there are 0.4 to 1.2 mols of (i) per gram-(hydroxyl group) (that is to say 17 g) of (ii). The new compositions have improved fluidity characteristics and pot life, and adhere easily to most surfaces without using a primer and can be used particularly to protect electronic connections.

REFERENCES:
patent: 3057469 (1962-10-01), Bond et al.
patent: 3527659 (1970-09-01), Keil
patent: 3758441 (1973-09-01), Nitzsche et al.

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