Multilayered electroplating process utilizing fine gold

Details Multilayered electroplating process utilizing fine gold Multilayered electroplating process utilizing fine gold

1990-01-03

1991-09-24

Niebling, John F.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428672, 204 40, 63 2, B32B 1501, B32B 1520, C25D 510, C25D 512

Patent

active

050513176

ABSTRACT:
Disclosed herein is a process for the electrodepositing multiple layers of fine gold and bright nickel upon a substrate layer. Fine gold is defined as being 99.99% pure. By insulating bright nickel between layers of fine gold, the galvanic effect is substantially reduced. This process is uniquely suited to jewelry products, where the substrate layers are ordinarily composed of brass.

REFERENCES:
patent: 3708405 (1973-01-01), Kamata
patent: 3963455 (1976-06-01), Nobel et al.
patent: 4533605 (1985-08-01), Hoffman
patent: 4601958 (1986-07-01), Levine
patent: 4666796 (1987-05-01), Levine
patent: 4835067 (1989-05-01), Levine
Nobel et al., "An Evaluation of 18 Karat and 24 Karat Hard Gold Deposits for Contact Applications", Plating, Jul. 1973.

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