Vibrating template method of placing solder balls on the I/O pad

Details Vibrating template method of placing solder balls on the I/O pad Vibrating template method of placing solder balls on the I/O pad

1997-01-24

1998-11-24

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29841, 228245, 228246, H01R 900

Patent

active

058391916

ABSTRACT:
Solder balls are placed onto multiple I/O pads of an integrated circuit package by the steps of a) providing a template with a channel which has multiple openings on a surface of the template that match the pattern of the I/O pads; b) pouring a plurality of the solder balls onto the surface of the template; c) vibrating the template and thereby seating a respective solder ball in each of the template openings; d) turning the template over, after the vibrating step and while a vacuum is applied to the channel, to remove excess solder balls from the template; and e) removing the vacuum from the channel when the solder balls on the turned over template are aligned to the I/O pads of the integrated circuit package. Due to the vibrating step, the solder balls settle in the template openings in a position where vacuum leaks past the solder balls become minimized; and that stops the solder balls from dropping out of the template openings when the template is turned over. Also, since the steps a-d place the solder balls on all of the I/O pads in parallel, the time in which those steps are performed is many times smaller than the time in which a pick and place machine can put the solder balls on all of the I/O pads sequentially.

REFERENCES:
patent: 4871110 (1989-10-01), Fakasawa et al.
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5626277 (1997-05-01), Kawada
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5680984 (1997-10-01), Sakemi

Affiliated with

Also associated with

Rating

Vibrating template method of placing solder balls on the I/O pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vibrating template method of placing solder balls on the I/O pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vibrating template method of placing solder balls on the I/O pad will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1692106