Mother-board interconnection system

Geometrical instruments

Patent

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Details

339 66M, H01R 1364

Patent

active

039633012

ABSTRACT:
An electronic packaging system for a digital data processing system is disclosed. The packaging system includes a multi-layer printed circuit mother-board having a plurality of double-ended pass-through electrical male contacts arranged in a plurality of similar patterns. The patterns of male contacts conform to and mate in electrical contact with the pattern of electrical female contacts of an electrical connector assembly. The electrical connector assembly is comprised of an insulative connector body having a mating surface and, parallel thereto, stepped, different-dimensioned, first, second and third bottom edges. Three parallel rows of parallel apertures pass through the connector body from the mating surface to the first, second and third bottom edges for forming three rows of stepped, different-dimensioned length apertures. Electrical female contacts of substantially similar design are loosely held in each of the apertures with their tail portions projecting beyond the associated one of said first, second or third bottom edges. The tail portions are then bent 90.degree. to form a pattern of parallel rows of parallel bent tail portions for forming a pattern of male terminals in which the tail portions of each of the three parallel rows are of different stepped dimensions as determined by the respective aperture lengths. Printed circuit daughter-boards or flexible printed circuit cables are then soldered to the bent tail portions which are then broken off at the surface thereof to form continuous electrical contact with the printed circuitry on the so-coupled daughter-boards or flexible cable. A keyed connector guide stand-off and a connector polarizing key are provided to mate with conforming recesses in the insulative connector body for ensuring that a particular electrical connector assembly mates with a particular pattern of male contacts that project from the mother-board and that permit male contact-to-male contact back panel wiring to pass freely under the keyed connector guide stand-off.

REFERENCES:
patent: 3166372 (1965-01-01), Just
patent: 3177462 (1965-04-01), Sarnmark
patent: 3611272 (1971-10-01), Fairbairn
patent: 3651444 (1972-03-01), Desso
patent: 3740697 (1973-06-01), Van Son

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