Method of making multilayer printed circuit board

Details Method of making multilayer printed circuit board Method of making multilayer printed circuit board

1974-09-16

1976-01-20

Lanham, C. W.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 317101B, H05K 300

Patent

active

039329321

ABSTRACT:
A method of making a multilayer board in which relatively thick ground and voltage planes are punched to form clearance holes. The planes are stacked with insulative layers, laminated and then drilled to produce through holes aligned with the clearance holes. The through holes are then plated-through. The method eliminates under-etch problems in thick ground and voltage planes which are capable of carrying high magnitudes of current.

REFERENCES:
patent: 3563819 (1971-02-01), Rheingold et al.
patent: 3617613 (1971-11-01), Benzinger et al.
patent: 3691632 (1972-09-01), Smith
patent: 3719536 (1973-03-01), Rheingold et al.
patent: 3739469 (1973-06-01), Dougherty, Jr.

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