Method for forming identifying characters on a silicon wafer

Details Method for forming identifying characters on a silicon wafer Method for forming identifying characters on a silicon wafer

1998-05-11

2000-03-14

Kunemund, Robert

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438906, 438959, 216 94, 347224, H01L 21302

Patent

active

060372591

ABSTRACT:
After identifying characters are written on the wafer surface 16 as a pattern of small holes 19 formed with a laser in the wafer I.D. stage of a semiconductor manufacturing process, the wafer surface in the region of the I.D. is polished to break loose deposits of silicon 20 that are left on the wafer surface and the region is then washed. The process prevents semiconductor material deposited on the wafer surface during the laser operation from later breaking off as hard particles that can scratch the surface of the wafer.

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