Subassemblies for optoelectronic hybrid integrated circuits

Details Subassemblies for optoelectronic hybrid integrated circuits Subassemblies for optoelectronic hybrid integrated circuits

1988-03-03

1990-02-27

Lee, John D.

350 9617, 357 74, G02B 612

Patent

active

049040367

ABSTRACT:
Optoelectronic chips, such as Group III-V compound lasers and photodiodes, are mounted on a single-crystal silicon base, and are optically interconnected to one another by silica waveguides and couplers integrally formed on the base. Integrated circuit chips to provide electronic function are also mounted on the base. Various schemes for optically coupling and aligning lasers, photodiodes and optical fibers to the waveguides are described. Also described is the use of a single-crystal silicon lid, which serves to provide optical and electrical isolation between chips on the base, as well as a plug-in arrangement in which the edges of the base are adapted to receive parallel guide rods.

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