Method and apparatus for inspecting solder portions

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364525, 382150, 348129, G06F 1700

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active

054954240

ABSTRACT:
A solder portion is inspected as follows. An image of the solder portion is obtained. The image of the solder portion is collated with a plurality of predetermined reference patterns corresponding to different solder portion types respectively. A type of the solder portion is identified in response to a result of the collation. A decision is made as to whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.

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Seminar Text "New Image Processing Technique for Remarkably Changing Visual Inspection Process", Society of Engineers of Precision Engineering, pp. 38-46, Jan. 26, 1989.
"Digital Image Processing", by Gonzalez et al, Addison-Wesely Publishing Co., Massachusetts, USA, pp. 118-136 and 320-325, 1977.
"Computer Vision", by Ballard et al, Prentice-Hall, Inc., New Jersey, USA, pp. 352-382, 1982.

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