Semiconductor device having metal foil integral with sealing res

Details Semiconductor device having metal foil integral with sealing res Semiconductor device having metal foil integral with sealing res

1998-02-27

2000-02-08

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

257729, 257787, 257788, 257790, H01L 2308, H01L 2310, H01L 2314

Patent

active

060230967

ABSTRACT:
A semiconductor device with a metal foil and a sealing resin material. Metal foil is formed integrally with the sealing resin layer.

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