Semiconductor device

Details Semiconductor device Semiconductor device

1989-04-28

1990-08-21

Hille, Rolf

357 68, 357 74, H01L 2340, H01L 2334, H01L 2312, H01L 2348

Patent

active

049511246

ABSTRACT:
A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.

REFERENCES:
patent: 4609040 (1986-09-01), Moore
patent: 4611389 (1986-09-01), Blair et al.
patent: 4691765 (1987-09-01), Wozniczka
patent: 4707726 (1987-11-01), Tinder
patent: 4709302 (1987-11-01), Jordan
patent: 4710852 (1987-12-01), Keen
patent: 4712159 (1987-12-01), Clemens
U.S. Ser. No. 121,955, filed on Nov. 18, 1987, entitled "Single In-Line Type Semiconductor Device".

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