Integrated circuit chip assembly utilizing selective backside de

Details Integrated circuit chip assembly utilizing selective backside de Integrated circuit chip assembly utilizing selective backside de

1988-09-30

1990-08-21

Hille, Rolf

Wave transmission lines and networks

Automatically controlled systems

With control of equalizer and/or delay network

333246, 333 33, 357 80, H01L 2302

Patent

active

049511238

ABSTRACT:
The invention is an improved integrated circuit chip assembly which provides enhanced heat transfer from active electronic devices of the integrated circuit by significantly reducing the thickness of the substrate and providing the necessary structural support through a thermally conducting spacing segment between the substrate and a ground plane in the region of the active electronic devices. This improvement further permits added flexibility in the design of transmission lines by permitting adjustment of the distance between the transmission line and the ground plane and furthermore by permitting the introduction of a second dielectric material such that the impedance of the transmission line may be controlled.

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