Test socket for electronic device packages

Details Test socket for electronic device packages Test socket for electronic device packages

1988-07-29

1990-08-21

Eisenzopf, Reinhard J.

Electrical connectors

With coupling movement-actuating means or retaining means in...

324 725, 324158F, 324158P, 439296, G01R 102, G01R 104

Patent

active

049509802

ABSTRACT:
A socket having an array of terminals adapted for insertion into a burn-in board is adapted to interconnect respective pins of a high pin density integrated circuit package to the terminals. The socket includes a lid with an array of holes for receiving the pins and registering the pins with underlying terminal openings and a cam mechanism actuable to move the lid relative to the terminals to cause the pins to make contact with the terminals within the openings. Mounting of the package on the socket and insertion of the pins into underlying terminal openings is accomplished with zero insertion force applied to the pins. Actuation of the cam mechanism causes the pins to contact respective terminals without deforming the pins.

REFERENCES:
patent: 3348146 (1967-10-01), Freund et al.
patent: 4047780 (1977-09-01), Cedrone
patent: 4068170 (1978-01-01), Chayka
patent: 4405191 (1983-09-01), Fettig
patent: 4547960 (1985-10-01), Di'Troia
patent: 4774462 (1988-09-01), Black
"Semiconductor Test Handler", by Abraham Western Electric Tech. Dig. 7/78, #51, pp. 1-2.

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