Mounting structure for semiconductor device

Details Mounting structure for semiconductor device Mounting structure for semiconductor device

1988-11-25

1990-08-21

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174259, H05K 100

Patent

active

049508431

ABSTRACT:
A mounting structure for a semiconductor device which is mounted onto a metallic wiring layer formed on a surface portion of a metal printed circuit board, in which bonding portions defined by substantially square etched holes are formed in a portion of the metallic wiring layer contacting a bonding material interposed between the metallic wiring layer and the body of the semiconductor device.

REFERENCES:
patent: 3745227 (1973-07-01), Chernick et al.
patent: 3851223 (1974-11-01), Yonezuka et al.
patent: 3972062 (1976-07-01), Hopp
patent: 3984166 (1976-10-01), Hutchison
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4654248 (1987-03-01), Mohammed

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