Method for manufacturing a solar cell from a substrate wafer

Details Method for manufacturing a solar cell from a substrate wafer Method for manufacturing a solar cell from a substrate wafer

1994-03-29

1996-02-27

Fourson, George

Fishing, trapping, and vermin destroying

437 3, 437228, H01L 3118

Patent

active

054948320

ABSTRACT:
Through-holes are formed in a substrate wafer by electrochemical etching, so that a perforated, self-supporting layer of n-doped, monocrystalline silicon arises. An n-doped region and a p-doped region that form a pn-junction and that both adjoin a first principal face of the self-supporting layer are produced in the self-supporting layer. A contact to the n-doped region and a contact to the p-doped region are formed on the first principal face, so that the pn-junction can be interconnected as solar cell into which the light incidence can occur via a second principal face lying opposite the first.

REFERENCES:
patent: 3969746 (1976-07-01), Kendall et al.
patent: 4409423 (1983-10-01), Holt
patent: 5306647 (1994-04-01), Lehmann et al.
Rudolf Muller, Springer-Verlag, Berlin-Heidelberg-New York, 1979, Bauelemente der Halbleiter-Elektronik, pp. 45-47.
K. Fukui et al., "Through Hole Back Contact Solar Cell", Fourth Sunshine Workshop on Crystalline Solar Cells, Technical Digest pp. 25-29 (date unknown).

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