Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1989-04-26
1990-08-21
Childs, Sadie
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
20419214, 20419215, 427 47, 427124, 427125, 427250, 4272557, 427404, 427427, B05D 306, B05D 512
Patent
active
049504991
ABSTRACT:
A compliant sealing material with low or no gas permeability and low spring rate is made by coating a metal such as gold, on the surface of a polymer sheet. The metal acts as a complete gas barrier on an atomic level, and the polymer provides structural integrity and mounting attributes without detrimentally increasing compliance. A small number of metal atoms injected at a moderate energy into the near surface of the polymer act as link sites for joining subsequent lower energy atoms forming an impermeable layer. The total heat delivery to the polymer is minimized thereby preserving integrity and continuity. The material is particularly useful in micromechanical devices where high flexibility is needed with complete sealing.
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Roberts et al., "Increase of Gold-Teflon FEP Joint Strength by Removal of Deposited Aluminum Prior to Gold Deposition for Electret Applications", Journal of Appl. Polymer Science, vol. 20, pp. 255-265, 1976.
Mattox, "Adhesion and Surface Preparation" Deposition Technologies for Films and Coatings, Chapter 3, pp. 74-81, 1982.
Chopra, "Mechanical Effects in Thin Films", Thin Film Phenomena, pp. 316-319, 1979.
Anderson Richard A.
Martin John R.
Childs Sadie
The Foxboro Company
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